Bridge chip interconnect system

Details Bridge chip interconnect system Bridge chip interconnect system

1991-10-04

1993-07-06

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

29827, 29850, 174 88R, 174257, 174261, 361408, 257666, 257735, H02G 1508, H01L 2348

Patent

active

052256332

ABSTRACT:
A bridge chip interconnect system is used for electrically interconnecting first and second semiconductor chip devices. The first and second semiconductor chip devices each are mounted adjacent to each other with a space therebetween and respectively have first and second row of ohmic contact pads on their top surfaces. The bridge chip interconnect system includes a rigid bridge base which has a top surface and which is placed in the space between the first and second semiconductor chip devices; and a plurality of conducting beams which are fixed to the top surface of the rigid bridge base and which have dimensions to enable each of them to make contact with one of the ohmic contact pads form each of the first and second row of ohmic contact pads.

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