Breakdown voltage resistor obtained through a double ion-implant

Metal treatment – Compositions – Heat treating

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148187, 357 13, 357 91, H01L 322, H01L 21265, H01L 2990

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active

042984017

ABSTRACT:
An implanted resistor structure for semiconductor integrated circuit devices is formed by a double ion-implantation providing a high breakdown voltage resistor.

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Zandveld, P., Solid St. Electronics, 19 (1976), 659.
Alcorn et al., IBM-TDB, 22 (Oct. 1979), 1973.
Lebesnerais et al., IBM-TDB, 20 (1974), 1471.
Putney, Z. C., "Simultaneous Formation of High Sheet Resistance . . . ", IBM TDB, vol. 20, No. 10, Mar. 1978, pp. 4011-4012.

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