Break-before-make sensing for drivers

Details Break-before-make sensing for drivers Break-before-make sensing for drivers

2004-07-07

2008-12-16

Tan, Vibol (Department: 2819)

Electricity: power supply or regulation systems

Output level responsive

Using a three or more terminal semiconductive device as the...

C323S271000, C323S282000, C361S021000, C361S058000, C361S076000, C327S566000

Reexamination Certificate

active

07466113

ABSTRACT:
A driver package includes an integrated circuit (IC) comprising pull up circuitry capable of turning ON an associated switch and pull down circuitry capable of turning OFF the associated switch. The pull up circuitry may be coupled to a first bonding pad of the IC, and the pull down circuitry may be coupled to a second bonding pad of the IC. The driver package may further comprise a first conductive path coupled between the first bonding pad and a package pin of the driver package, where the package pin is coupled to the associated switch, and a second conductive path coupled between the second bonding pad and the package pin. The first conductive path may further provide a sensed signal representative of state of the associated switch to break before make control circuitry to assist in minimizing a break before make delay time interval.

REFERENCES:
patent: 5610503 (1997-03-01), Fogg et al.
patent: 5815427 (1998-09-01), Cloud et al.
patent: 6025705 (2000-02-01), Nguyen et al.
patent: 6269451 (2001-07-01), Mullarkey
patent: 6459343 (2002-10-01), Miller
patent: 2002/0154464 (2002-10-01), Vinciarelli et al.
English translation of Chinese Office Action issued in related Chinese Patent Application No. 2005100844x (2 pages).

Affiliated with

Also associated with

Rating

Break-before-make sensing for drivers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Break-before-make sensing for drivers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Break-before-make sensing for drivers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4027832