Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1989-03-03
1990-05-08
Godici, Nicholas P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174152GM, 361405, 29843, 228122, 228248, 22826312, B23K 3526, H05K 100, H01R 900
Patent
active
049240331
ABSTRACT:
According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, vacuum furnace is not employed.
REFERENCES:
patent: 4409181 (1983-10-01), Coad
patent: 4431465 (1984-02-01), Mizuhara
patent: 4447392 (1984-05-01), Mizuhara
patent: 4611745 (1986-09-01), Nakahashi et al.
patent: 4672739 (1987-06-01), Churchwell et al.
patent: 4835344 (1989-05-01), Iyogi et al.
IBM Technical Disclosure Bulletin, Phelps et al., vol. 24, No. 1B, pp. 859, 860, Jun. 1981.
IBM Technical Disclosure Bulletin, Phelps et al., vol. 24, No. 2, pp. 1212, 1213, Jul. 1981.
IBM Technical Disclosure Bulletin, Ward, vol. 24, No. 6, p. 2974, Nov. 1981.
IBM Technical Disclosure Bulletin, Miller et al., vol. 24, No. 12, pp. 6430, 6431, May 1982.
Patent Abstracts of Japan, vol. 12, No. 201 (M-707)[3048], Jun. 10, 1988; corresponds to JP-A-63 5895.
Patent Abstracts of Japan, vol. 11, No. 281 (M-624)[2728], Sep. 11, 1987; corresponds to JP-A-62 81290.
Magazine of "Electronics", Metal-Ceramic Brazed Seals; R. J. Bondley; pp. 97-99, Jul. 1947.
Iyogi Kiyoshi
Nakahashi Masako
Shirokane Makoto
Takeda Hiromitsu
Godici Nicholas P.
Heinrich Samuel M.
Kabushiki Kaisha Toshiba
LandOfFree
Brazing paste for bonding metal and ceramic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Brazing paste for bonding metal and ceramic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Brazing paste for bonding metal and ceramic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2350407