Brazing method using patterned metallic film having high wettabi

Details Brazing method using patterned metallic film having high wettabi Brazing method using patterned metallic film having high wettabi

1993-09-28

1995-04-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

With shaping

228215, 228209, 228254, 228190, B23K 120

Patent

active

054029260

ABSTRACT:
A method of brazing a plurality of components by heating the components superposed on each other with a brazing material interposed between adjacent bonding surfaces of the components, wherein the brazing material has a relatively low degree of wettability with respect to the material of the components to be brazed, and is applied to a patterned film of a high-wettability metal having a relatively high degree of wettability with respect to the brazing material, which film is formed on at least one of bonding surfaces of the components, so as to cover predetermined areas of the bonding surface while leaving adjacent non-bonding areas of the bonding surface uncovered so as to restrict the flow of brazing material.

REFERENCES:
patent: 3110102 (1963-11-01), Pfeffkorn
patent: 3330027 (1967-07-01), Kernander et al.
patent: 4530464 (1985-07-01), Yamamoto et al.
patent: 4603805 (1986-08-01), Rogers
patent: 4875619 (1989-10-01), Anderson et al.
patent: 4960236 (1990-10-01), Hedges et al.
patent: 4972989 (1990-11-01), Black et al.
Patent Abstracts of Japan, vol. 014, No. 161 (E-909), Mar. 28, 1990 & JP-A-02 017 603 (Matsushita Electric Inc Co) Jan. 22, 1990.
Database WPI, Week 7914, Derwent Publications Ltd., London, GB; AN 7926885B 14 & JP-A-54 026 459 (Matsushita Elec Ind K.K.) Feb. 28, 1979.

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