Brazing material

Details Brazing material Brazing material

1989-02-24

1990-05-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

22826312, 428620, B23K 104

Patent

active

049211587

ABSTRACT:
A mechanical and electrical bond between a silicon semiconductor wafer and a molybdenum contact is created by a multi-layer brazing material. The material includes adjacent layers of titanium and silver along with a layer which is either composed of aluminum or an aluminum-silicon composite. The material is heated to a temperature above its melting point. The aluminum reacts first with the silver, thereby dissolving less of the silicon. This reduces spiking and lowers the contact resistance.

REFERENCES:
patent: 3650826 (1972-03-01), Ganser
patent: 4602731 (1986-07-01), Dockus
Dalal et al "Ti-Cr-Al/Cu Interconnection Metallurgy . . . ", from IBM Technical Disclosure Bulletin, vol. 26, No. 8, Jan. 1984, p. 4003.

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