Brazeless ceramic-to-metal bonding for use in implantable device

Details Brazeless ceramic-to-metal bonding for use in implantable device Brazeless ceramic-to-metal bonding for use in implantable device

1996-03-25

1998-04-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

2281246, B23K 2000

Patent

active

057382700

ABSTRACT:
In method of forming a hermetically sealed electrical feedthrough comprising, a feedthrough is positioned in a hole, the hole passing through a structure. The feedthrough includes a first material and the structure including a second material. A compressive force directed at the structure is applied to the feedthrough, and an equal force directed at the feedthrough is applied to the structure. The equal force is applied in a direction opposite the compressive force. The feedthrough and the structure are heated to a diffusion temperature whereat the first material and the second material undergo diffusion so as to cause a hermetically sealed bond between the first and second materials, and the hermetically sealed bond is thereby formed between the feedthrough and the structure.

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