Braze assembly with beryllium diffusion barrier and method...

X-ray or gamma ray systems or devices – Beam control – Window

Reexamination Certificate

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C228S262310

Reexamination Certificate

active

07869574

ABSTRACT:
A bonded assembly includes a member, and a substrate comprising beryllium, the substrate configured to be bonded to the member. The bonded assembly includes a first barrier applied to a surface of the substrate, a second barrier applied to a surface of the first barrier, a bonding material disposed between the second barrier and the member, and wherein the second barrier is configured to prevent dissolution of the first barrier into the bonding material.

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Araki et al., “Manufacturing and testing of a Be / OFHC—Cu divertor module,” Journal of Nuclear Materials, 1996, pp. 632-637.

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