Box-in-box field-to-field alignment structure

Details Box-in-box field-to-field alignment structure Box-in-box field-to-field alignment structure

2007-09-25

2007-09-25

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C430S022000, C257SE21521, C257SE21529, C438S015000, C438S016000

Reexamination Certificate

active

10959551

ABSTRACT:
A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent box and a second translucent box. The second scribe includes at least a first opaque box and a second opaque box defined respectively by a first translucent frame and a second translucent frame. When the lithographic pattern is stepped between fields on a wafer, the first translucent box is placed at least partially within the first opaque box, and the second translucent box is placed at least partially within the second opaque box. If a continuous ring is formed from a pair of a translucent box and an opaque box, the fields are aligned at least within an amount equal to the difference between the dimensions of that translucent box and that opaque box divided by 2.

REFERENCES:
patent: 4780615 (1988-10-01), Suzuki
patent: 5017514 (1991-05-01), Nishimoto
patent: 5250983 (1993-10-01), Yamamura
patent: 6027859 (2000-02-01), Dawson et al.
patent: 6319791 (2001-11-01), Ando
patent: 6713843 (2004-03-01), Fu
patent: 7068833 (2006-06-01), Ghinovker et al.

Affiliated with

Also associated with

Rating

Box-in-box field-to-field alignment structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Box-in-box field-to-field alignment structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Box-in-box field-to-field alignment structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3735462