Package making – Methods – With contents treating
Patent
1997-07-11
1999-04-20
Culver, Horace M.
Package making
Methods
With contents treating
53458, 53468, 53471, 53486, 53487, 53492, 53281, 53289, 53290, 533814, 53510, B65B 6900, B65B 2300, B65B 728, B65B 3102
Patent
active
058947116
ABSTRACT:
A box handling apparatus having particular application in the packaging of semiconductor wafers, includes a box opening assembly which can unlatch a lid from a bottom of the box and separate the lid from the bottom. Arms can grip an article, such as a wafer cassette, in the bottom of the box and lift it out. The cassette can be loaded, or wafers already in the cassette unloaded. The apparatus can replace the loaded cassette in the bottom of the box and latchingly re-engage the lid.
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Anderson Gary L.
Davidson James P.
Hampton Gordon P.
Lenk James C.
Lunday Andrew Paul
Culver Horace M.
MEMC Electronic Materials , Inc.
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