Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-01-06
2001-03-13
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S688000, C361S703000, C361S704000, C361S707000, C361S713000, C361S720000, C361S721000, C174S016300, C174S252000, C165S080300, C165S185000
Reexamination Certificate
active
06201700
ABSTRACT:
TECHNICAL FIELD
The present invention relates to packaging a plurality of electronic circuit boards within a single housing and including thermal conductive path controls that communicate with external housing fins.
BACKGROUND ART
It has become common practice in the field of electronics to integrate a plurality of electronic circuit boards into one mechanical housing. There are many benefits and advantages gained by integrating a plurality of electronic circuit boards into one housing. For instance, packaging space is increased because fewer modules are needed, the overall weight of the vehicle is reduced, wiring harnesses and connectors are reduced, further reducing costs.
One significant problem associated with integrating the plurality of electronic circuit boards into one housing is the damage that thermal energy (heat) can cause within the housing. Prior art solutions have been to increase the surface area of the housing by the arrangements of heat dissipation fins on the surface of the housing. Generally, heat is dissipated primarily through the operation of heat convection as air moves across and through the heat dissipation fins. However, numerous connectors and components remain subjected to highly heated locations that affect performance, shorten life and reliability of the circuit boards.
Another solution to the thermal energy build-up within the multi-board housing was to add a thermally conductive material between the inside surfaces of the housing arid the top surfaces of the electronic circuit boards which are adjacent the inside surfaces of the housing. Although, this additional conduction path would in some cases act to dissipate some additional thermal energy, this solution has been observed to not provide sufficient heat dissipation for more complex and highly integrated electronic assemblies.
Therefore, a need exists for an improved system and method for dissipating thermal energy created by a super integrated multiple electronic circuit board assembly. The new and improved system and method for dissipating heat must provide sufficient heat dissipation regardless of the complexity and increased integration of the multiple electronic circuit board assembly.
DISCLOSURE OF INVENTION
Accordingly, it is an object of the present invention to provide a system and method for increasing heat dissipation in an electronic module having multiple electronic circuit boards by providing a thermal path between the circuit boards.
In accordance with these and other objects of the present invention a system and method are provided for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing controlled thermal path between the circuit boards. The method includes utilizing a heat conductive housing with a plurality of external extending fins for increasing the surface area of the housing and correspondingly increasing heat convection from the housing and a heat conductive path is disposed between the plurality of electronic circuit boards for transporting thermal energy to the housing. Finally, the heat path, preferably a layer of conductive material, is applied to the inner surface of the housing and between each of the electronic circuit boards. The present invention increases heat conduction from the components on this plurality of electronic circuit boards to the housing.
In accordance with another aspect of the present invention, a system is provided for dissipating thermal energy created by multiple electronic circuit boards packaged within the single housing. The system includes a heat conductive housing having a plurality of longitudinally extending fins for increasing the surface area of the housing and thereby increasing heat convection across the surface of the housing. A heat conductive material disposed adjacent to an inner surface of the housing and between each electronic circuit board for promoting heat conduction to the housing. The present invention utilizes both heat conduction and heat convection to maximize thermal energy dissipation through the housing to prevent damage or failure of the electronic components packaged within the housing.
The above objects and other objects, features, and advantages for the present invention are readily apparent from the following detailed description of the best mode for carrying out the invention when taken in connection with the accompanying drawings.
REFERENCES:
patent: 5208733 (1993-05-01), Besanger
patent: 5251099 (1993-10-01), Goss et al.
patent: 5309320 (1994-05-01), Smith
patent: 5798171 (1998-08-01), Olson
patent: 5812374 (1998-09-01), Shuff
patent: 5969953 (1999-10-01), Purdom et al.
patent: 5986887 (1999-11-01), Smith et al.
patent: 6014313 (2000-01-01), Hesselbom
patent: 6028769 (2000-02-01), Zurek
patent: 6072697 (2000-06-01), Garcia-Ortiz
McCarthy Robert J.
Tzinares Alexander
Wall Steven L.
Chervinsky Boris L.
Ford Motor Company
Picard Leo P.
Stec Jennifer M.
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