Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-04-24
2011-12-13
Kim, Paul D (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S595000, C029S609100, C205S119000, C205S122000, C310S366000, C310S320000, C333S150000, C333S187000, C333S193000, C333S195000, C333S196000
Reexamination Certificate
active
08074341
ABSTRACT:
A method for manufacturing a boundary acoustic wave device includes the steps of preparing a laminated structure in which an IDT electrode is disposed at an interface between first and second solid media and reforming the first medium and/or the second medium by externally providing the laminated structure with energy capable of reaching the inside of the first medium and/or the second medium and thus adjusting a frequency of the boundary acoustic wave device. The above provides a boundary acoustic wave device manufacturing method that enables frequency adjustment to be readily performed with high accuracy.
REFERENCES:
patent: 4933588 (1990-06-01), Greer
patent: 5010270 (1991-04-01), Greer
patent: 5260913 (1993-11-01), Kadota et al.
patent: 5918354 (1999-07-01), Ikegami et al.
patent: 7262676 (2007-08-01), Ruile et al.
patent: 2006/0071579 (2006-04-01), Kando
patent: 2007/0018536 (2007-01-01), Kadota et al.
patent: 2007/0176711 (2007-08-01), Kando
patent: 2007/0222337 (2007-09-01), Kadota et al.
patent: 63-246911 (1988-10-01), None
patent: 02-224514 (1990-09-01), None
patent: 09-107264 (1997-04-01), None
patent: 09-326668 (1997-12-01), None
patent: 2000-295060 (2000-10-01), None
patent: 2001-077661 (2001-03-01), None
patent: 2005-150787 (2005-06-01), None
patent: WO 2004070946 (2004-08-01), None
patent: 2006/114930 (2006-11-01), None
Official Communication issued in International Patent Application No. PCT/JP2007/071106, mailed on Feb. 5, 2008.
Kando Hajime
Mimura Masakazu
Keating & Bennett LLP
Kim Paul D
Murata Manufacturing Co. Ltd.
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