Bottom side stiffener probe card

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C029S854000, C324S754090

Reexamination Certificate

active

10925260

ABSTRACT:
A probe card for production testing of semiconductor imaging die includes a stiffener supported on a bottom side of the probe card. The top of the stiffener is substantially flush with a top surface of the probe card. A light passage through the stiffener features non-reflective surfaces. Surfaces surrounding the light passage are arranged to avoid casting any shadows on the imaging die being tested. The arrangement provides a low profile probe card. A source of light used to illuminate the imaging die through the light passage can be placed close to the imaging device under test, providing few false negatives and more consistent results from wafer to wafer.

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