Bottom side heat sink attachment for console

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S689000, C361S697000, C361S719000, C165S080300, C165S185000, C174S016300, C174S252000, C245S004000, C245S004000

Reexamination Certificate

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07142427

ABSTRACT:
A system of mounting a heat sink to a processor in a console is provided. The processor is mounted on a first side of a PCB and the heat sink is mounted to the first side of the PCB so as to be in contact with the processor. A plurality of studs are mounted to the heat sink and extend through passageways in the PCB. A spring element is mounted to the studs on the second side of the PCB. A thrust plate is mounted to the spring element so that the spring element can press the thrust plate against the second side of the PCB. The spring element thus provides a force that aids in ensuring the heat sink and the processor are in tight contact. The studs can be attached to a housing via fasteners so the housing supports the heat sink rather than the PCB.

REFERENCES:
patent: 5847928 (1998-12-01), Hinshaw et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5883783 (1999-03-01), Turturro
patent: 6008990 (1999-12-01), Liu
patent: 6055159 (2000-04-01), Sun
patent: 6304445 (2001-10-01), Bollesen
patent: 6560113 (2003-05-01), Ma
patent: 7042727 (2006-05-01), Ulen et al.
patent: 2005/0231918 (2005-10-01), Goldmann

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