Bottom lead semiconductor package with recessed leads and fabric

Details Bottom lead semiconductor package with recessed leads and fabric Bottom lead semiconductor package with recessed leads and fabric

1997-09-17

1999-10-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257696, 257730, 257773, H01L 2348, H01L 23488, H01L 23495, H01L 2350

Patent

active

059634332

ABSTRACT:
A bottom lead semiconductor package includes a plurality of bottom leads with inner leads extended upwardly bent or inclined from corresponding ones of the bottom leads. A semiconductor chip is attached to an upper surface of each of the bottom leads by a nonconductive adhesive, and a plurality of conductive wires electrically connects a plurality of chip pads on the chip to the inner leads. A molding compound forms a package body having a plurality of openings such that a lower surface of each of the bottom leads is externally exposed. The fabrication method includes a molding step for sealingly molding the package but exposing the lower surface of the bottom leads and the inner leads upwardly bent extending from corresponding ones of the bottom leads. A mold with a plurality of protrusions on a bottom surface in the mold and the protrusions respectively serve to fill openings formed below each of the inner leads to prevent the flow of molding resin into the openings.

REFERENCES:
patent: 4862247 (1989-08-01), Derryberry et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5428248 (1995-06-01), Cha
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5760471 (1998-06-01), Fujisawa et al.
patent: 5770888 (1998-06-01), Song et al.

Affiliated with

Also associated with

Rating

Bottom lead semiconductor package with recessed leads and fabric does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bottom lead semiconductor package with recessed leads and fabric, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bottom lead semiconductor package with recessed leads and fabric will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1179046