Bottom fixation type integrated circuit chip cooling structure

Details Bottom fixation type integrated circuit chip cooling structure Bottom fixation type integrated circuit chip cooling structure

2005-04-05

2005-04-05

Ciric, Ljiljana (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300, C165S080400, C165S104330, C361S700000

Reexamination Certificate

active

06874568

ABSTRACT:
A bottom fixation type integrated circuit chip cooling structure device. The device is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between the top and bottom plate member, and connecting members are provided between the top and bottom plate members each having a bottom end passed through a respective through hole in the bottom plate member and a bottom screw hole in the bottom end for mounting. A heat sink is bonded to the top surface of the top plate member, and an internally sintered metal capillary wick is provided within the vapor chamber.

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