Boron phosphide-based semiconductor device and production...

Stock material or miscellaneous articles – Composite – Of b – n – p – s – or metal-containing material

Reexamination Certificate

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C428S688000, C257S102000, C257S103000, C257S190000, C438S565000, C438S566000, C438S569000, C438S935000

Reexamination Certificate

active

07018728

ABSTRACT:
A boron phosphide-based semiconductor device includes a single crystal substrate having formed thereon a boron-phosphide (BP)-based semiconductor layer containing boron and phosphorus as constituent elements, where phosphorus (P) occupying the vacant lattice point (vacancy) of boron (B) and boron occupying the vacant lattice point (vacancy) of phosphorus are present in the boron-phosphide (BP)-based semiconductor layer. The boron phosphide-based semiconductor device includes a p-type boron phosphide-based semiconductor layer in which boron occupying the vacancy of phosphorus is contained in a higher atomic concentration than phosphorus occupying the vacancy of boron and a p-type impurity of Group II element or Group I V element is added.

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