Boron modified molybdenum silicide and products

Metal treatment – Stock – Chromium – molybdenum – or tungsten base

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420429, C22C 2704

Patent

active

058659099

ABSTRACT:
A boron-modified molybdenum silicide material having the composition comprising about 80 to about 90 weight % Mo, about 10 to about 20 weight % Si, and about 0.1 to about 2 weight % B and a multiphase microstructure including Mo.sub.5 Si.sub.3 phase as at least one microstructural component effective to impart good high temperature creep resistance. The boron-modified molybdenum silicide material is fabricated into such products as electrical components, such as resistors and interconnects, that exhibit oxidation resistance to withstand high temperatures in service in air as a result of electrical power dissipation, electrical resistance heating elements that can withstand high temperatures in service in air and other oxygen-bearing atmospheres and can span greater distances than MoSi.sub.2 heating elements due to improved creep resistance, and high temperature structural members and other fabricated components that can withstand high temperatures in service in air or other oxygen-bearing atmospheres while retaining creep resistance associated with Mo.sub.5 Si.sub.3 for structural integrity.

REFERENCES:
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patent: 5595616 (1997-01-01), Berczik
Contributions to the Nowotny Phases; Powder Metallurgy Bulletin vol. B, (1957), pp. 23-34, Parthe.
Lattice Dimensions of Low-Rate Metalloid-Stabilized Ti.sub.5 Si.sub.3 ; High Temperatures--High Pressures, 1974, vol. 6, pp. 515-517, Quakernaat, et al.
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Untersuchungen in den Dreistoffsystemen: Molybdaen-Silizium-Bor Wolfram-Silizium-Bor und in dem System: VSi.sub.2 -TaSi.sub.2 ; Moratscheft Fur Chemie, 88, 180 (1957), and translation attached thereto.
Evaluation of A.sub.5 Si.sub.3 Z.sub.x Intermetallics for Use as High Temperatures Structural Materials; published Jul., 1994, 26 pages; Thom, Meyer, Kim and Akinc.
"Creep Resistance of Boron Doped Mo.sub.5 Si.sub.3 ", American Ceramic Soc. 97th, Annual Meeting, Cincinnati, Apr. 30-May 3, 1995, Meyer et al.
"Oxidation Resistance and Compressive Creep Behavior of Boron Doped Mo.sub.5 Si.sub.3 " Advanced Ceramic for Structural and Tribological Applications, Aug. 23, 1995, Meyer et al.
"Compressive creep behavior of Mo.sub.5 Si.sub.3 with the addition of boron", Intermetallic 4, 1996, Meyer et al.
"The Potential For Use of Mo.sub.5 Si.sub.3 In High Temperature Applications" American Ceramic Soc, Annual Meeting, Apr. 26, 1994, Meyer et al.

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