Boron-carbon-silicon polymers and ceramic and a process for the

Details Boron-carbon-silicon polymers and ceramic and a process for the Boron-carbon-silicon polymers and ceramic and a process for the

1991-01-18

1992-07-14

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Carbide or oxycarbide containing

501 93, 501 96, 501 97, C04B 3556

Patent

active

051302780

ABSTRACT:
The present invention relates to a process for the production of an organoborosilicon preceramic polymer of the structure: ##STR1## wherein R.sup.1 is selected from alkyl having from 1 to 10 carbon atoms or phenyl, and x is selected from 0, 1, 2 or 3;

REFERENCES:
patent: 3154520 (1964-10-01), Dupont
patent: 4152509 (1979-05-01), Yajima
patent: 4235987 (1980-11-01), Peters
patent: 4604367 (1986-08-01), Takamizawa et al.
patent: 4767728 (1988-08-01), Riccitiello et al.
E. C. Ashby, Journal of the American Chemical Society, vol. 81, p. 4791 (1959).
M. F. Hawthorne, J. Org. Chem. (1959), V. 23, p. 1788.
M. F. Hawthorne, J. Amer. Chem. Soc. (1960), vol. 82, p. 748.
H. Steinberg et al. (ed) (1964), Progress in Boron Chemistry, The MacMillan Company, New York, N.Y.
G. E. Legrow et al., American Ceramic Soc. Bulletin, (1987), vol. 66, 32, pp. 363-367.
R. J. Brotherton et al (ed) (1970), Progress in Boron Chemistry, vol . 3, Pergamon Press, New York, N.Y., p. 299.
K. J. Wynne et al. Annual Reviews of Materials Science, vol. 14, pp. 297-333 (1984).
R. W. Rice, American Ceramic Society Bulletin, vol. 66, p. 363 (1983).
M. S. Hsu et al., Polymer Preprint, vol. 27, #2, p. 261 (1986).

Affiliated with

Also associated with

Rating

Boron-carbon-silicon polymers and ceramic and a process for the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Boron-carbon-silicon polymers and ceramic and a process for the , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Boron-carbon-silicon polymers and ceramic and a process for the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-334535