Boosted potential generating circuit

Miscellaneous active electrical nonlinear devices – circuits – and – Specific identifiable device – circuit – or system – With specific source of supply or bias voltage

Reexamination Certificate

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Details

C327S537000

Reexamination Certificate

active

06288601

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a boosted potential generating circuit. The present invention has particular application to a semiconductor memory device, such as a dynamic random access memory (DRAM), for feeding the word lines with a boosted potential with respect to a power supply potential.
BACKGROUND ART
FIGS. 6-9
show a conventional boosted potential generating circuit. In
FIG. 6
, the boosted potential generating circuit has a clock input node
1
for receiving a clock (CLK) signal of binary levels consisting of a ground potential (0V) and a power supply potential (Vcc), as shown in FIG.
8
(
a
), and a boosted potential node
2
for supplying a boosted potential. A load capacitor
3
is driven by the boosted potential supplied to the boosted potential node
2
, and the load capacitor
3
is a parasitic capacitance existing between the boosted potential node and the ground potential node. An N-channel type MOS transistor
4
serves as a drive transistor for the boosted potential generating circuit, and is connected between the boosted potential node
2
and a first node
5
. A gate electrode is connected to a second node
6
, and a back gate (a p-well region
12
in
FIG. 7
) is connected to an output node of potential generating means (not shown) for outputting a negative potential Vbb.
A first buffer means
7
receives the clock signal from the clock input node
1
and outputs a first signal in phase with the clock signal. The first buffer means
7
comprises an even number of stages, or in this example, inverters
7
a
and
7
b
of two stages. A first capacitive element
8
has a pair of electrodes, where one electrode receives the first signal from the first buffer means
7
and the other electrode is connected to the first node
5
. A second buffer means
9
receives the clock signal from the clock input node
1
and outputs a second signal in phase with the clock signal. The second buffer means
9
comprises an even number of stages, or in this example, inverts
9
a
and
9
b
of two stages. A second capacitor
10
has a pair of electrodes, where one electrode receives the second signal from the second buffer means
9
and the other electrode is connected to the second node
6
.
FIG. 7
illustrates the boosted potential generating circuit incorporated in a semiconductor memory device, such as a dynamic random access memory (DRAM), with the N-channel type MOS transistor
4
having a pair of source and drain regions
13
and
14
formed in a p-well region
12
formed on a major surface of a semiconductor substrate
11
, and a gate electrode
15
. Since the semiconductor substrate
11
is supplied with the negative potential Vbb, the negative potential Vbb is also supplied back gate of the N-channel type MOS transistor
4
. In
FIG. 7
, a P-channel type MOS transistor is also fabricated with the N-channel type MOS transistor
4
. The P-channel type MOS transistor comprises a pair of source and drain regions
17
and
18
formed in an n-well region
16
formed on the major surface of a semiconductor substrate
11
, and a gate electrode
19
. Such a structure is generally referred to as a twin well structure. An oxide film
20
surrounds an element forming region to electrically isolate the elements.
The first and second nodes
5
and
6
in
FIG. 6
are precharged to the power supply potential Vcc (or a potential lower than the power supply potential by a threshold voltage of a MOS transistor) prior to application of the boosted potential to the boosted potential node
2
by a precharge means (not shown). Before the boosted potential is supplied to the boosted potential node
2
(or before time T
0
shown in FIG.
8
), the first and second nodes
5
and
6
are precharged to the power supply potential Vcc by the precharge means. As a result, the potential of the boosted potential node
2
is set at Vcc−Vth
4
by conduction of the N-channel type MOS transistor
4
, where Vth
4
is a threshold voltage of the N-channel type MOS transistor. Referring to a waveform diagram shown in
FIG. 8
, the operation of the boosted potential generating circuit is as follows.
At time T
0
, i.e., when the clock signal shown in FIG.
8
(
a
) is fed to the clock input node
1
, inputs potentials of the first and second buffer means
7
and
9
rise to the power supply potential, and output potentials of the first and second buffer means
7
and
9
rise from the ground potential (0V) to the power supply potential Vcc, thereby raising the potentials of the first and second capacitive elements
8
and
10
. The electrodes on one side of the first and second capacitive elements
8
and
10
are boosted from the ground potential (0V) to the power supply potential Vcc, so that the potentials of the first and second nodes
5
and
6
are raised from Vcc, which is the precharge potential, to two times Vcc by capacitive coupling of the first and second capacitive elements
8
and
10
.
The N-channel type MOS transistor
4
then conducts since its drain potential becomes 2Vcc; its gate potential becomes 2Vcc; and its source potential becomes Vcc−Vth
4
. Further, the charges at the first capacitive element
8
flow into the boosted potential node
2
through the N-channel type MOS transistor
4
and are stored thereat, so that the potential of the boosted potential node
2
is boosted to Vcc−Vth
4
+&agr;. The boosted portion &agr; of the potential at the boosted potential node
2
is determined from the capacitance shared between the capacitances of the first capacitive element
8
and the load capacitor
3
.
Then, at time T
1
, i.e., when the clock signal falls to the ground potential, the potentials of the first and second buffer means
7
and
9
also fall to the ground potential, so that the potentials of the first and second nodes
5
and
6
fall to Vcc by the capacitive coupling of the first and second capacitive elements
8
and
10
. The N-channel type MOS transistor
4
becomes nonconductive, because its drain potential equals Vcc; its gate potential equals Vcc; and its source potential equals Vcc−Vth
4
+&agr;. Hence, there is no charge flow from the boosted potential node
2
to the first node
5
.
Next, when the clock signal is raised again to the power supply potential Vcc at time T
2
, the outputs of the first and second buffer means
7
and
9
rise from the ground potential to the power supply potential Vcc, thereby (similar to above) raising the potentials of the first and second capacitive elements
8
and
10
, and boosting the potentials of the first and second nodes
5
and
6
to two times Vcc. Further, the N-channel type MOS transistor
4
becomes conductive, and the charges at the first capacitive element
8
flow into the boosted potential node
2
through the N-channel type MOS transistor
4
, thereby further raising the potential of the boosted potential node
2
. The potential of the boosted potential node
2
is thus boosted stepwise at every rise of the clock signal from the ground potential to the power supply potential, and the boosted potential of 2Vcc−Vth
4
is finally obtained at the boosted potential node
2
.
As shown in
FIG. 9
, since the N-channel type MOS transistor
4
, in which the negative potential Vbb is fed to the back gate, is used as the drive transistor, the substrate potential (potential of the p-well region
12
, i.e., the effective substrate potential) viewed from the source electrode (or the electrode connected to the boosted potential node
2
in this situation) is very deep, and the threshold voltage Vth
4
is large. Hence, the boosted potential Vpp obtained at the boosted potential node
2
cannot obtain a high potential.
Another type of a boosted potential generating circuit is shown in
FIGS. 10-12
, which is not affected from the threshold voltage Vth
4
, and hence is capable of rendering a higher boosted potential Vpp at the boosted potential node
2
. The boosted potential generating circuit of
FIG. 10
includes an N-channel type MOS transistor
4
with a structure capable of b

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