Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Body contact wave transfer
Reexamination Certificate
2011-07-19
2011-07-19
Kuntz, Curtis (Department: 2614)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Body contact wave transfer
C381S326000, C381S380000
Reexamination Certificate
active
07983431
ABSTRACT:
The object is to provide a bone conduction device and its tympanum, wherein the bone conduction device can be efficiently mounted without generating a dead space in a case having a limited installation space such as a cellular phone's case having a large display screen. A magnetic sound converter device has an outer magnetic structure wherein a voice coil (3) is mounted on a center magnetic pole (2) of a yoke (1) and a magnet (4) is arranged on the outer side of the voice coil (3). The yoke (1) and the center magnetic pole (2) thereof are vertically long, the magnet (4) is arranged on the short side edge parts on the both sides of the yoke, and a tympanum fixing part (6) is arranged on the outer side of each magnet (4) on a magnet arrangement axis.
REFERENCES:
patent: 2202906 (1940-06-01), Hawley
patent: 2459325 (1949-01-01), Knowles
patent: 2482044 (1949-09-01), Vernier
patent: 5337364 (1994-08-01), Fitch
patent: 6141427 (2000-10-01), Fukuda
patent: 11-355871 (1999-12-01), None
patent: 2001-313989 (2001-11-01), None
patent: 2002-199480 (2002-07-01), None
patent: 2003-340370 (2003-12-01), None
patent: 2001111653 (2001-12-01), None
Kuntz Curtis
Robinson Ryan
Schmeiser Olsen & Watts LLP
Temco Japan Co., Ltd,
LandOfFree
Bone conduction device and tympanum thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bone conduction device and tympanum thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bone conduction device and tympanum thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2619360