Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Rod – strand – filament or fiber
Patent
1995-05-12
1996-09-10
Edwards, N.
Stock material or miscellaneous articles
Coated or structually defined flake, particle, cell, strand,...
Rod, strand, filament or fiber
428379, 428383, 428390, 174120SR, D02G 300
Patent
active
055544436
ABSTRACT:
A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the bonding wire comprises an elongated fine wire of electrically conductive material, and first and second non-conductive coating layers. The first non-conductive coating layer covers the elongated fine wire and is of a material having good insulating property and heat resistance. The second non-conducting coating layer covers the first non-conductive coating layer and is of a material having good abrasion resistance. The first non-conductive coating layer includes at least one aromatic polyester resins, and the second non-conductive coating layer includes at least one resin selected from the group consisting of polyurethanes, polyester imides and polyimides. The second non-conductive coating layer is built up from a plurality of successive coats to define the second non-conductive coating layer as a non-conductive multilayer coating structure.
REFERENCES:
patent: 3523820 (1970-08-01), Sheffer
patent: 4331800 (1982-05-01), Inata et al.
patent: 4342814 (1982-08-01), Usuki et al.
patent: 4379807 (1983-04-01), Otis et al.
patent: 4420535 (1983-12-01), Walrath et al.
patent: 4459383 (1984-07-01), Lee
patent: 4503124 (1985-03-01), Kean et al.
patent: 4505978 (1985-03-01), Smith
patent: 4511624 (1985-04-01), Kawaguchi et al.
patent: 4537804 (1985-08-01), Kean et al.
patent: 4678114 (1987-07-01), Egawa et al.
patent: 4751107 (1988-06-01), Reiter et al.
patent: 4942105 (1990-07-01), Yu
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 5396104 (1995-03-01), Kimura
Kimura Masao
Kondo Hiroyuki
Onodera Kiyoshi
Tatsumi Kohei
Donaldson Richard L.
Edwards N.
Hiller William E.
Nippon Steel Corporation
Texas Instruments Incorporated
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