Bonding wire, semiconductor device having the same, and bonding

Details Bonding wire, semiconductor device having the same, and bonding Bonding wire, semiconductor device having the same, and bonding

1982-09-24

1984-12-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228111, 228176, H01L 2160

Patent

active

044886748

ABSTRACT:
The invention provides a bonding wire which prevents electric short-circuiting even if it comes into contact with another bonding wire, a bonding method using the same, and a semiconductor device including the same. The bonding wire comprises a core wire made of a metal and an insulating film which surrounds it. The insulating film is eliminated from the ends of the bonding wire by thermal decomposition and scattering, while simultaneously each end of the bonding wire is connected to a bonding pad of the semiconductor device or to a lead frame. In the semiconductor device, the bonding pads are respectively connected to lead frames by means of the bonding wires.

REFERENCES:
patent: 3646307 (1972-02-01), Hazel
patent: 3673681 (1972-07-01), Steranko
patent: 4002282 (1977-01-01), Murdoch

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