Bonding wire inspection method

Details Bonding wire inspection method Bonding wire inspection method

1992-12-01

1994-09-13

Evans, F. L.

Optics: measuring and testing

By polarized light examination

With light attenuation

356384, G01B 1100

Patent

active

053473620

ABSTRACT:
A method of inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame taking the steps of: bringing the focus of an optical assembly into a desired point of a bonded wire, thus obtaining the height of such a desired point of the wire as a reference; photographing an image of the wire at the reference height; and then obtaining the height of the wire based upon the amount of the indistinct image of the photographed wire.

REFERENCES:
patent: 4942618 (1990-07-01), Sumi et al.

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