Bonding wire inspection apparatus

Optics: measuring and testing – By polarized light examination – With light attenuation

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356375, 250561, G01B 1100

Patent

active

052932176

ABSTRACT:
An apparatus for inspecting, for example, balls and crescents of wires bonded between a semiconductor chip and a lead frame including an optical system installed above an object of inspection, a vertical illuminator that illuminates the object of inspection, a CCD camera which has a photoelectric converter element provided at an imaging level of the optical system, and X, Y and Z tables which move the CCD camera in the X, Y and Z directions. Since only the photoelectric converter element of the CCD camera is movable in the X, Y and Z directions when focusing is made into the object of inspection, the size of the X, Y and Z tables can be small, and in addition, since the optical system and vertical illuminator are not movable, dirt is prevented from falling onto the object of inspection.

REFERENCES:
patent: 2731878 (1956-01-01), Sherwin
patent: 4373817 (1983-02-01), Coates
patent: 4872052 (1989-10-01), Liudzius et al.
patent: 4874956 (1989-10-01), Kato et al.
patent: 5030008 (1991-07-01), Scott et al.
patent: 5138180 (1992-08-01), Yamanaka

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