Metal working – Barrier layer or semiconductor device making
Patent
1998-03-17
2000-05-09
Graybill, David E.
Metal working
Barrier layer or semiconductor device making
H01L 2100
Patent
active
060598468
ABSTRACT:
A device for inspecting a high loop of a wire bonded on, for instance, a lead frame including a frame carrying stand, which guides and supports a lead frame, and an inspection roller, which is installed directly above the frame carrying stand. The inspection roller has frame pressing parts made as an insulating part so as to press the side portions of the lead frame against the frame carrying stand 31; and the inspection roller further has a wire detection part made as conductive parts provided between the frame pressing ring. A step or height difference between the frame pressing parts and the wire detection part is formed so as to be equal to the upper-limit value of the maximum height of wire loops formed by the bonded wire, and high loops that exceed the upper-limit value are detected by way of an electric current that flows when the wire detection part contacts the bonded wire.
REFERENCES:
patent: 5293217 (1994-03-01), Sugawara
patent: 5298989 (1994-03-01), Tsukahara et al.
patent: 5394246 (1995-02-01), Sugawara
Arai Hisashi
Inomata Masaru
Shimura Masayuki
Graybill David E.
Kabushiki Kaisha Shinkawa
LandOfFree
Bonding wire height inspection device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding wire height inspection device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding wire height inspection device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1060333