Bonding wire ball formation

Details Bonding wire ball formation Bonding wire ball formation

1989-05-17

1990-03-20

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 42, 219 5621, B23K 2024, B23K 3700

Patent

active

049094270

ABSTRACT:
A ball bonding apparatus is provided with a "flame off" electrode which is positioned, during flame off, around and above the capillary tool so that the spark for melting the wire passes in close proximity to the end of the capillary tool. The flame off electrode is preferably mounted on the capillary tip.

REFERENCES:
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4476366 (1984-10-01), Kurtz et al.
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4594493 (1986-06-01), Harrah et al.

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