Bonding wire

Details Bonding wire Bonding wire

1987-07-16

1988-06-21

Dean, R.

Alloys or metallic compositions

Gold base

420508, 420511, 428606, 428620, C22C 502

Patent

active

047524421

ABSTRACT:
A bonding wire for use in semiconductor devices which consists essentially of 0.0003 to 0.01 wt. % of barium and the balance gold, the gold purity of said bonding wire being at least 99.99%. The bonding wire may further contain at least one element selected from the group consisting of 0.0005 to 0.005 wt. % of aluminum, 0.0001 to 0.003 wt. % of calcium, 0.0005 to 0.005 wt. % of silver and 0.0005 to 0.005 wt. % of palladium. The total content of the elements and barium in the bonding wire should not exceed 0.01 wt. % based on the weight of the bonding wire so that the gold purity of the bonding wire is at least 99.99%. The use of the additive elements improve the mechanical strength and wire-bondability, making the bonding wire highly suitable for use in wire bonding of semiconductor elements, especially for high-speed bonding.

REFERENCES:
patent: 4080485 (1978-03-01), Bonkohara
patent: 4330329 (1982-05-01), Hayashi et al.

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