Bonding verification process incorporating test patterns

Details Bonding verification process incorporating test patterns Bonding verification process incorporating test patterns

1989-03-29

1990-07-31

Seidel, Richard K.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, 228 8, 228179, 228104, B23K 119

Patent

active

049444476

ABSTRACT:
A bonding verification process which incorporates bonding test patterns and verifies the integrity of bonds by inspecting the bonding test patterns. For a bonding agent of solder, the bonding verification process verifies the integrity of solder connections by inspecting the bonding test patterns. The bonding test patterns can be implemented in a variety of configurations which verify several properties of the soldering process.

REFERENCES:
patent: 4224744 (1980-09-01), Siegel et al.
patent: 4467638 (1984-08-01), Greenstein
patent: 4667869 (1987-05-01), Gen et al.
patent: 4696104 (1987-09-01), Vanzetti et al.
patent: 4792683 (1988-12-01), Chang et al.
IBM Technical Disclosure Bulletin, vol. 22, No. 9, p. 4068, Feb. 1980.
IBM Technical Disclosure Bulletin, vol. 27, No. 5, p. 2967, Oct. 8, 1984.
Becker, "New Test Method Measures Solderability of Plated-Through Holes", Insulation Circuits, pp. 73-78, Dec. 1976.
Manko, Solders and Soldering, Sections 8-4, 8-5, 8-6, copyright 1979.
Metals Handbook Ninth Edition, vol. 6, pp. 1069, 1076, 1077, 1088-1091, 1101, copyright 1983.

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