Bonding-type surface-mount crystal oscillator

Details Bonding-type surface-mount crystal oscillator Bonding-type surface-mount crystal oscillator

2008-06-10

2010-06-29

Kinkead, Arnold (Department: 2817)

Oscillators

With outer casing or housing

C331S10800D, C331S154000, C331S158000, C331S1160FE, C331S1160FE

Reexamination Certificate

active

07746184

ABSTRACT:
A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.

REFERENCES:
patent: 6819191 (2004-11-01), Funahara et al.
patent: 6882232 (2005-04-01), Harima
patent: 6967537 (2005-11-01), Harima et al.
patent: 6998926 (2006-02-01), Miyazaki et al.
patent: 2007/0120614 (2007-05-01), Moriya et al.
patent: 10-098151 (1998-04-01), None
patent: 2001-007647 (2001-01-01), None

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