Bonding tool with resistance

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S180500

Reexamination Certificate

active

07032802

ABSTRACT:
A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed.

REFERENCES:
patent: 2892924 (1959-06-01), Wood
patent: 3538205 (1970-11-01), Gates, Jr. et al.
patent: 3563443 (1971-02-01), Perdotti et al.
patent: 3660050 (1972-05-01), Iler et al.
patent: 3938722 (1976-02-01), Kelly et al.
patent: 3986255 (1976-10-01), Mandal
patent: 3986653 (1976-10-01), Gilding
patent: 4020543 (1977-05-01), Pennings
patent: 4157932 (1979-06-01), Hirata
patent: 4171477 (1979-10-01), Funari
patent: 4182947 (1980-01-01), Brower
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4331048 (1982-05-01), Dworak et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4502983 (1985-03-01), Omori et al.
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4691854 (1987-09-01), Haefling et al.
patent: 4705204 (1987-11-01), Hirota et al.
patent: 4772498 (1988-09-01), Bertin et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 4842662 (1989-06-01), Jacobi
patent: 4897710 (1990-01-01), Suzuki et al.
patent: 4899921 (1990-02-01), Bendat et al.
patent: 4909427 (1990-03-01), Plaisted et al.
patent: 4998002 (1991-03-01), Okikawa et al.
patent: 5123935 (1992-06-01), Kanamaru et al.
patent: 5178742 (1993-01-01), Lemke et al.
patent: 5180093 (1993-01-01), Stansbury et al.
patent: 5214259 (1993-05-01), Terakado et al.
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5280979 (1994-01-01), Poli et al.
patent: 5290507 (1994-03-01), Runkle
patent: 5341979 (1994-08-01), Gupta
patent: 5347086 (1994-09-01), Potter et al.
patent: 5367956 (1994-11-01), Fogle, Jr.
patent: 5427301 (1995-06-01), Pham et al.
patent: 5463197 (1995-10-01), Miyazaki
patent: 5491605 (1996-02-01), Hughbanks et al.
patent: 5527441 (1996-06-01), Offer
patent: 5544804 (1996-08-01), Test et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5616257 (1997-04-01), Harada et al.
patent: 5649355 (1997-07-01), Offer
patent: 5651901 (1997-07-01), Mohri et al.
patent: 5676856 (1997-10-01), Haji et al.
patent: 5797388 (1998-08-01), Nakamura et al.
patent: 5816472 (1998-10-01), Linn
patent: 5827470 (1998-10-01), Chatterjee et al.
patent: 5931368 (1999-08-01), Hadar et al.
patent: 6030472 (2000-02-01), Hajaligol et al.
patent: 6073827 (2000-06-01), Razon et al.
patent: 6219911 (2001-04-01), Estes et al.
patent: 6337522 (2002-01-01), Kang et al.
patent: 6354479 (2002-03-01), Reiber et al.
patent: 6646355 (2003-11-01), Kang et al.
patent: 6651864 (2003-11-01), Reiber et al.
patent: 6759642 (2004-07-01), Hoshino
patent: 2005/0109817 (2005-05-01), Reiber
patent: 0435423 (1991-07-01), None
patent: 2287897 (1995-10-01), None
patent: 54037114 (1979-03-01), None
patent: 63164228 (1988-07-01), None
patent: 02-67741 (1990-03-01), None
patent: 04-149065 (1992-05-01), None
patent: 06-45389 (1994-02-01), None
U.S. Appl. No. 10/942,311, filed Sep. 15, 2004, Reiber, Flip Chip Bonding Tool Tip.
Stan Weitz, “Trends in ESD Test Methods,” Materials Testing Section of the ETS Testing Laboratory, Electrotech Systems, 1998, pp. 1-7.
Instrument FAQs, Drivers, Libraries and Examples, Keithley Instrument Model 6517/6517A, Keithley Instruments, Inc., 1999, pp. 1-2.
Keithley Instruments Model 6517A Electrometer/High Resistance Meter, Keithley Instruments, Inc., pp. 1-9 (date unknown).
“Low-Current/High-Resistance Meters,” Keithley Instruments Model 6517A, Keithley Instruments, Inc. pp. 112-115 (date unknown).
Keytech 200 XV-2 ESD Simulator, Kandus Equipment, p. 1 (date unknown).
Newburg, Carl E., “Test Report”, Anza Technology, Incorporated Static Dissipative Ceramic Rods . . . Report 190:2000-92, River's Edge Technical Service, Nov. 29, 2000, pp. 1-5.
Huntsman, James et al., “Test Methods for Static Control Products,” Electrical Overstress/Electrostatic Discharge Sym., Sep. 21, 1982, pp. 94-109, vl.4, IIT Rsrch Inst.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding tool with resistance does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding tool with resistance, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding tool with resistance will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3612375

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.