Bonding tool with polymer coating

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S180500

Reexamination Certificate

active

07077304

ABSTRACT:
A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.

REFERENCES:
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4691854 (1987-09-01), Haefling et al.
patent: 4950365 (1990-08-01), Evans
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5871141 (1999-02-01), Hadar et al.
patent: 5879808 (1999-03-01), Wary et al.
patent: 5931368 (1999-08-01), Hadar et al.
patent: 6171456 (2001-01-01), Hadar et al.
patent: 2002/0100790 (2002-08-01), Sonnenreich et al.
patent: 2004/0129755 (2004-07-01), Macover
patent: 1244143 (2000-09-01), None
patent: 2 165 178 (1986-04-01), None
patent: 11-284014 (1999-10-01), None
patent: WO 98/18570 (1998-05-01), None
International Search Report dated Aug. 9, 2002, Application No. PCT/US02/02546.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding tool with polymer coating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding tool with polymer coating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding tool with polymer coating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3525634

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.