Bonding tool, production and handling thereof

Details Bonding tool, production and handling thereof Bonding tool, production and handling thereof

1993-06-28

1994-12-20

Ramsey, Kenneth J.

Measuring and testing

Surface and cutting edge testing

G01B 2120

Patent

active

053737318

ABSTRACT:
A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of tile concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

REFERENCES:
patent: 5197651 (1993-03-01), Nakamura et al.
patent: 5213248 (1993-05-01), Horton et al.

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