Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1995-08-30
1998-10-06
Ryan, P. J.
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 45, B23K 2010
Patent
active
058164723
ABSTRACT:
A bonding tool for use in tape automated bonding and wedge bonding of gold and gold plated leads or wires to contact pads of electronic devices is fabricated of Aluminum Oxide ceramic without electrically conductive metallic binders. The bonding tool has a microscopically rough surface that is brought into compressive contact with the gold leads or wires and manipulated ultrasonically or thermosonically in order to form a molecular bond between the gold lead or wire and the contact pad of the electronic device. The Aluminum Oxide ceramic bonding tool is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions and is not readily abraded by the gold leads.
REFERENCES:
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4776509 (1988-10-01), Pitts et al.
patent: 5147082 (1992-09-01), Krause et al.
patent: 5180093 (1993-01-01), Stansbury et al.
M.K. Avedissian, "Multidirectional Ultransonic Wire Bonding Tip," Western Electric Tech. Dig., No. 20, Oct. 1970, pp. 7-8.
"Bonding Capillaries for Thermosonic or Thermocompression Gold Wire Bonding," Small Precision Tools, Petaluma, CA, 1988.
Baan Cynthia S.
Hewlett--Packard Company
Knapp Jeffrey T.
Ryan P. J.
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