Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent
1994-09-29
1996-04-02
Heinrich, Samuel M.
Metal fusion bonding
Means to apply vibratory solid-state bonding energy to work
228 447, H01L 2160
Patent
active
055033210
ABSTRACT:
A bonding tool for connecting inner leads to pads of a semiconductor chip by means of high efficiency transmittance of ultrasonic vibrations is disclosed. The shape of the tool as seen in a plane parallel to the ultrasonic vibration is either to have a substantially flat plane on one side and a uniformly continuous sloped plane with a predetermined angle starting from a pressing face against the inner lead, or to have the shape of a uniformly continuous machined conical surface starting upwardly from the pressing face until the diameter of the cone reaches 200 .mu.m or more.
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IBM Technical Disclosure Bulletin, "Ultrasonic Bonding Tip", vol. 10, No. 12, p. 1892, May 1968.
IBM Technical Disclosure Bulletin, "Twin Grooved Bonding Tool", vol. 36, No. 10, pp. 589, 590, Oct. 1993.
Heinrich Samuel M.
NEC Corporation
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