Bonding tool and method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S281000

Reexamination Certificate

active

07942994

ABSTRACT:
A bonding tool and method A bonding tool and method for bonding together layers of a MEMS transducer device, including at least one layer of a piezoelectric material, and an intermediate reinforcing layer of titanium, or other metal, comprising: positioning the layers above one another and spaced apart by means of spacing members, heating said layers to a bonding temperature, and retracting the spacing members so as to bring the layers together under pressure to effect a bond between adjacent surfaces of the layers, wherein a press head is employed with a compliant caul for evenly distributing the press force; and permitting said layers to cool to an operating temperature in which said piezoelectric layer is under compressive strain and the titanium layer is under tensile strain.

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F. Niklaus et al., “Low Temperature Full Wafer Adhesive Bonding of Structured Wafers”, Sensors and Actuators A, 2001, vol. 92, pp. 235-241, Elsevier science B.V.

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