Bonding tool

Metal fusion bonding – Metallic heat applicator – Tip or head alloy or polymetallic structure

Patent

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Details

B23K 3102

Patent

active

039714993

ABSTRACT:
A bonding wedge for joining or bonding wire leads to contact areas or elements in the semiconductor and electronic industry including a rectangular wire guiding hole extending therethrough cooperating with a positioning groove formed on the bonding tip.

REFERENCES:
patent: 3627192 (1971-12-01), Killingsworth
patent: 3690538 (1972-09-01), Gaiser

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