Bonding tool

Details Bonding tool Bonding tool

1990-08-24

1993-03-30

Seidel, Richard K.

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 54, B23K 3700

Patent

active

051976510

ABSTRACT:
A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si.sub.3 N.sub.4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase synthesis method.

REFERENCES:
patent: 3911246 (1975-10-01), Drinkard, Jr.
patent: 3940050 (1976-02-01), Johnson et al.
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4560853 (1985-12-01), Ziegel
patent: 4605343 (1986-08-01), Hibbs et al.
patent: 4689276 (1987-08-01), Jacquez
patent: 4767050 (1988-08-01), Flood et al.
patent: 4884476 (1989-12-01), Okuzumi
patent: 4940180 (1990-07-01), Martell
patent: 5020394 (1991-06-01), Nakamura et al.
IBM Disclosure, "Multipoint Thermocompression Bands," vol. 11 No. 3 Aug. 1968, p. J11.
"Chemical Abstracts", 111(8), 317, abstract no. 62922w (Aug. 21, 1989).
World Patent Index Latest, week 8909, Derwent Publications Ltd., London, GB (JP-A-10 21 076) (Jan. 24, 1989) abstract.

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