Bonding structures and methods of forming bonding structures

Details Bonding structures and methods of forming bonding structures Bonding structures and methods of forming bonding structures

2006-11-27

2010-12-14

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C257S618000

Reexamination Certificate

active

07851331

ABSTRACT:
A semiconductor structure includes a first substrate and a second substrate bonded over the first substrate. The first substrate includes a passivation layer formed over the first substrate. The passivation layer includes at least one first opening exposing a first bonding pad formed over the first substrate. The second substrate includes at least one second opening aligned with and facing the first opening.

REFERENCES:
patent: 6075712 (2000-06-01), McMahon
patent: 6268660 (2001-07-01), Dhong et al.
patent: 6846725 (2005-01-01), Nagarajan et al.
patent: 7056813 (2006-06-01), Morrow et al.
patent: 7274099 (2007-09-01), Hsu
patent: 2005/0113004 (2005-05-01), Brandes
patent: 2006/0220222 (2006-10-01), Zeng
patent: 2007/0170583 (2007-07-01), Kwon et al.
patent: 2582177 (2003-10-01), None
patent: 101131948 (2008-02-01), None
Semiconductor International Nov. 2003 at http://www.tf.uni-kiel.de/matwis/amat/semi—en/running—term/articles—seminar... Jul. 19, 2006, 5 pages.
Tanaka et al., Low-Cost Through-hole Electrode Interconnection for 3D-SiP Using Room-temperature Bonding, 2006 Electronic Components and Technology Conference, pp. 814-818.
Xintec Inc., “Wafer Level Innovative Pack”, at http://www.xintec.com.tw/product/main.htm on Feb. 9, 2006, 4 pages.

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