Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-12-06
2005-12-06
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S780000, C257S778000, C257S787000
Reexamination Certificate
active
06972490
ABSTRACT:
A bonding structure with compliant bumps includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer has thickness smaller than the stopper structure and compliant bumps. It can be separated or connected with stoppers.
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Chang Shyh-Ming
Chen Wen-Chih
Huang Yuan-Chang
Yang Sheng-Shu
Industrial Technology Research Institute
Parekh Nitin
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