Bonding structure of substrates and method for bonding substrate

Details Bonding structure of substrates and method for bonding substrate Bonding structure of substrates and method for bonding substrate

1989-09-01

1991-03-12

Heinrich, Sam

Metal fusion bonding

Process

Plural joints

228254, 228123, 357 65, 437209, H01L 2150, H01L 2158, H05K 334

Patent

active

049986651

ABSTRACT:
First and second substrates are provided with a projection of a high melting point conductive material and an aperture filled at the bottom plane with a low melting point conductive material, respectively. The projection of the first substrate is plunged into the low melting point conductive material which is molten in the aperture by heating, so that the projection and the low melting point conductive material are bonded mechanically and electrically by cooling.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3778530 (1973-12-01), Reimann
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4605153 (1986-08-01), Van Den Breckel et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4836435 (1989-06-01), Napp et al.

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