Bonding structure for a hard disk drive suspension using...

Details Bonding structure for a hard disk drive suspension using... Bonding structure for a hard disk drive suspension using...

2007-04-17

2007-04-17

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000, C174S259000

Reexamination Certificate

active

10730263

ABSTRACT:
A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anistropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

REFERENCES:
patent: 5065505 (1991-11-01), Matsubara et al.
patent: 5463242 (1995-10-01), Castleberry
patent: 5611884 (1997-03-01), Bearinger et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5961334 (1999-10-01), Inaba

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