Bonding structure and method of making

Details Bonding structure and method of making Bonding structure and method of making

2005-01-27

2009-06-23

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C438S495000, C257SE23077, C257SE21567

Reexamination Certificate

active

07550365

ABSTRACT:
An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.

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