Bonding structure and method of making

Details Bonding structure and method of making Bonding structure and method of making

2005-03-29

2005-03-29

Meier, Stephen D. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S056000, C347S058000

Reexamination Certificate

active

06871942

ABSTRACT:
An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.

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