Bonding structure, actuator device and liquid-jet head

Details Bonding structure, actuator device and liquid-jet head Bonding structure, actuator device and liquid-jet head

2005-09-09

2008-07-15

Do, An H (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07399061

ABSTRACT:
A bonding structure including bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.

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