Bonding structure

Details Bonding structure Bonding structure

2007-01-31

2009-08-18

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S613000

Reexamination Certificate

active

07576430

ABSTRACT:
A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

REFERENCES:
patent: 5284896 (1994-02-01), Shimada et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 6972490 (2005-12-01), Chang et al.
patent: 7041589 (2006-05-01), Lay et al.

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