Bonding Si.sub.3 N.sub.4 ceramics

Details Bonding Si.sub.3 N.sub.4 ceramics Bonding Si.sub.3 N.sub.4 ceramics

1981-11-16

1983-05-24

McCarthy, Helen M.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156DIG99, 264 65, 264332, 423344, 428446, C04B 3558, C04B 3572

Patent

active

043849091

ABSTRACT:
Compositions are disclosed for securing Si.sub.3 N.sub.4 parts together, these compositions being in the .beta.'-Y.sub.2 Si.sub.2 O.sub.7 --Y.sub.3 Al.sub.5 O.sub.12 tetrahedron, e.g. compositions in mole % comprising (1) 15% Si.sub.3 N.sub.4, 79.1% Y.sub.2 Si.sub.2 O.sub.7 and 6.9% Y.sub.3 Al.sub.5 O.sub.12 or (2) 25% Si.sub.2 AlON.sub.3 and 75% Y.sub.3 Al.sub.5 O.sub.12 Y. A method of securing Si.sub.3 N.sub.4 parts together comprises placing the composition between the parts to be bonded and heating to brazing temperature (about 1600.degree. C.) in nitrogen.

REFERENCES:
patent: 4072532 (1978-02-01), Fletcher et al.
patent: 4143107 (1979-03-01), Ishii et al.
patent: 4234343 (1980-11-01), Andersson
patent: 4264550 (1981-04-01), Ezis
patent: 4280850 (1981-07-01), Smith et al.
patent: 4324356 (1982-04-01), Blair et al.
patent: 4347089 (1982-08-01), Loehman
patent: 4350771 (1982-09-01), Smith
Layden; G. K. "Development of SiAlON Materials" Report No. NASA CR 159675, Final Report Sep. 1979, 1-137 pages.

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