Metal fusion bonding – Solder form
Patent
1987-08-27
1989-12-19
Seidel, Richard K.
Metal fusion bonding
Solder form
2281802, 228253, 22826311, B23K 3100, B23K 3514, B23K 3524
Patent
active
048877603
ABSTRACT:
The bonding sheet of the present invention comprises a substrate having an opening, and a low-melting point bonding metal which closes the opening or is arranged on the peripheral portion of the opening, to project in the opening. According to a bonding sheet of the present invention, a low-melting point bonding metal is interposed between a conductor pattern of a substrate and electrode terminals of an electronic component, and is bonded by thermocompression at a low temperature without melting the low-melting point bonding metal, so that bonding of a large number of electrode terminals can be completed by a single bonding operation.
REFERENCES:
patent: 3568301 (1971-03-01), Shibata
patent: 4067104 (1978-01-01), Tracy
patent: 4646435 (1987-03-01), Grassauer
patent: 4705205 (1987-11-01), Allen et al.
IBM Technical Disclosure Bulletin, vol. 28, No. 3, Aug. 1985, pp. 1184-1185.
IBM Technical Disclosure Bulletin, vol. 27, No. 8, Jan. 1985, p. 4855.
IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, p. 627.
Hayashi Nobuo
Kubota Yuko
Morita Hiroshi
Nakano Hirotaka
Yoshino Thunekazu
Andes William Scott
Kabushiki Kaisha Toshiba
Seidel Richard K.
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