Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-11-14
2010-12-14
Koch, III, George R (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S358000, C156S360000, C156S378000, C156S379000
Reexamination Certificate
active
07850800
ABSTRACT:
A bonding sheet applying apparatus of the present invention includes an applying stage for supporting a board, an applying unit having a bonding-sheet supplying device for supplying a bonding sheet to above the board supported by the applying stage and an applying head provided above the board so as to be movable up and down, for sequentially pressing the bonding sheet supplied by the bonding-sheet supplying device on a plurality of applying positions arranged on the board, a transfer device for transferring the applying unit, which has completed a bonding sheet applying operation for one of the applying positions, to a position upward above another applying position at which a bonding sheet applying operation has not been completed, and an inspection device for inspecting an applied state of the bonding sheet which has already been applied by the applying unit, while the applying unit is successively performing the bonding sheet applying operations.
REFERENCES:
patent: 5403412 (1995-04-01), Hidaka et al.
patent: 6869491 (2005-03-01), Onitsuka
patent: 2004/0261947 (2004-12-01), Haraguchi
patent: 09-006251 (1997-01-01), None
patent: 10-027820 (1998-01-01), None
patent: 3324599 (2002-09-01), None
Machine translation of JP 09-006251 (filed in IDS by applicant). Original document published Jan. 1997, Japan.
International Search Report issued Dec. 12, 2006 in the International (PCT) Application of which the present application is the U.S. National Stage.
Patent Cooperation Treaty (PCT) International Preliminary Report on Patentability, issued May 27, 2008.
Tsujikawa Toshihiko
Ueno Tetsuro
Koch, III George R
Panasonic Corporation
Wenderoth , Lind & Ponack, L.L.P.
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