Bonding semiconductor chips to a mounting surface utilizing adhe

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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29832, 29840, 118411, 156295, 156299, 156578, 228 33, 239601, 427 96, B05D 114, B32B 3100, B05C 302

Patent

active

048031240

ABSTRACT:
A method of bonding semiconductor chips to a mounting surface and a nozzle for same includes the steps of applying a first deposit of a die attach adhesive material to the mounting surface in a manner wherein the first deposit has the general shape of a starfish. This starfish shape is characterized by a raised central portion disposed at the intersection of the radially inner ends of a plurality of centrally thickened arms. The next step is to apply the bonding surface of a semiconductor chip against the deposit to cause the deposit to spread therebeneath while removing air pockets and hence any voids within the die attach adhesive material. The volume of the deposit being proportional to the surface area of the bonding surface and the configuration of the first deposit being defined to cause uniform and symmetrical spreading of the first deposite across the bonding surface provides full coverage of the bonding surface with a uniformly thick layer of adhesive. A die attach dispensing tool or nozzle includes a bottom shape including recessed portions whereby when the bottom of the tool is disposed in confronting relation to a mounting surface a flow passage carrying die attach adhesive material can be employed to fill the recessed portions and thereby define a deposit of die attach material in the general shape of a starfish.

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patent: 4709849 (1987-12-01), Socolowski

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